RF & Microwave Industry News

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Agilent has a new application note titled "Understand the Basic Principles of Vector Network Analysis" available now.

RFMD will be exhibiting at IMS 2013 at booth 730. Explore the RFMD® industry-leading RF and microwave product portfolio with kiosks featuring solutions for WiFi and smart energy, wireless infrastructure, GaN RF power, and microwave MMICs.

NXP Semiconductors N.V. announced the availability of its ultra-wideband Doherty reference design using the BLF884P and BLF884PS – the industry’s first wideband Doherty power amplifiers capable of broadband operation (470 to 806 MHz). The new 70W DVB-T LDMOS designs bring the high-efficiency gains of Doherty topologies to broadcast transmitters, using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum.

LTE-capable networks will continue to mushroom around the globe through 2018. In particular, frequency-division duplex (FDD) networks will see their population coverage expanding at a compound annual growth rate (CAGR) of 33 percent between 2012 and 2018 to hit 57 percent. Time-division duplex (TDD) networks will gain ground at a more rapid rate of 43 percent during this period but will only reach 52 percent population coverage due to fewer licensed markets currently.

Exalt Communications, the leading innovator of next-generation wireless backhaul solutions, unveiled ExpandAir®, the company’s new point-to-multipoint (PMP) platform. The first system available in the platform is a sub-6 GHz non-line-of-sight offering based on Exalt’s exclusive eMIMO® technology, which brings performance, reliability, and security to a new level for value-priced point-to-multipoint microwave backhaul, accelerates deployment time, and reduces infrastructure costs.

Azimuth Systems Inc. and JDSU, two leaders in communications test and measurement products for the telecommunications industry, formally announced a collaboration to answer the mobile industry’s call for more efficient, effective and end-to-end test solutions.

Rogers Corp. will highlight several of its high quality printed circuit board (PCB) materialsat the upcoming 2013 IEEE International Microwave Symposium (IMS).  Rogers’ Advanced Circuit Materials representatives will be on hand at exhibition booth #1459. In addition, John Coonrod, Rogers Market Development Engineer, will be presenting “Determining Circuit Material Dielectric Constant from Phase Measurements.” as part of the technical program.

Sonnet Software Inc. announces a new product, Blink™, which is an easy-to-use EDA environment for the analysis of on chip passive devices such as spiral inductors and MIM capacitors.

MACOM introduced its series of GaN in Plastic packaged power transistors for high-performance civilian and military radar and communications systems. They scale to peak pulse power levels of 100 W – the highest among competing components in this product category.

Peregrine Semiconductor Corp., a fabless provider of high-performance radio frequency integrated circuits (RFICs), released four new DuNE™ Digitally Tunable Capacitors (DTCs), creating the industry’s broadest integrated RF tuning IC portfolio. The PE64906, PE64907, PE64908, and PE64909 DTCs feature a wide capacitance range of 0.6 – 7.7 pF and support power handling up to 34 dBm into 50 Ohms (30 Vpk RF).