RF & Microwave Industry News

Array Wireless announces new investment and management teams

Array Wireless Inc., a technology leader in the creation of efficient, high linearity microwave power amplifiers, announced a major financial investment in the company by Loma Vista Wireless Inc., and the addition of a seasoned management team to spur new growth initiatives. In addition to a cash infusion for new product initiatives, the company is expanding its facility size and hiring staff to accommodate increased design and production capacity.


Read More

AeroVironment and Alta Devices partner on solar powered unmanned systems

AeroVironment Inc. announced that a recent outdoor test flight of a solar-powered prototype version of the company’s proven Puma AE™ small unmanned aircraft system (UAS), operating with the company’s newest long-endurance battery, lasted 9 hours, 11 minutes – significantly longer than the flight endurance of small UAS being used in the field today. AeroVironment is working with Alta Devices, a Sunnyvale, CA company that provides flexible, portable power that can be embedded into any other material, in the development of the solar Puma AE.


Read More

Mobile network equipment vendors are leading the 3GPP standardization

There are many companies that contribute to 3GPP technologies, including WCDMA/HSPA, LTE, and the EPC; however, only a handful of companies stand out across the board. ABI Research looked at the number of chairmanships, rapporteurships, overall contributions, approved contributions, and discussion papers for 3GPP standards. This was done for RAN1, RAN2, RAN3, RAN4, RAN5, SA1, SA2, SA3, SA4, SA5, CT1, CT3, and CT4 from 2009 through 2012.


Read More

Rohde & Schwarz demonstrates its expertise in T&M at EuMW 2013

European Microwave Week is back in Germany once again. In Nuremberg, Rohde & Schwarz will present its wide range of T&M equipment for microwave applications. Experts from Rohde & Schwarz will also be holding ten workshops and seminars as part of the event program. The following test and measurement highlights will be on display in hall 7A, booth 106 at the NCC:    


Read More

DuPont Circuit & Packaging Materials and IQLP to develop high-speed circuit technology

DuPont Circuit & Packaging Materials (DuPont) and IQLP LLC, a division of Interplex Industries Inc., announced their ongoing efforts to further develop and refine liquid crystal polymer (LCP) thin-film technology for use in high-speed circuit applications.  The development efforts are being conducted pursuant to a joint development agreement and a license agreement previously entered into by the parties.


Read More

Sub-$200 smartphone shipments to exceed 750M in 2018

Low cost smartphones, defined as smartphones with a wholesale ASP below $200, are increasingly appearing in OEM and operator portfolios in both emerging and developed markets. The low hanging fruit for low cost smartphones is to drive smartphone adoption in emerging markets where handset subsidization and disposable income are scarce.  Market intelligence firm ABI Research forecasts low cost smartphone shipments to grow from 238 million in 2013 to 758 million by 2018, driven by the low penetration of smartphones and large subscriber bases found in BRIC countries.


Read More