RF & Microwave Industry News

Anritsu PIM Master earns innovation award from Frost & Sullivan

Test & Measurement

Anritsu Co. announces that its PIM Master MW82119A has earned the Frost & Sullivan 2013 Global New Product Innovation Award for PIM Test Equipment. In presenting Anritsu with the award, Frost & Sullivan stated, “the PIM Master MW82119A demonstrates Anritsu’s commitment towards delivering higher value to users of portable PIM test equipment while addressing evolving technological trends in the PIM testing market.”


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Agilent leads celebrations as EuMW 2013 breaks records

By the time that Agilent Technologies celebrated its tenth year as Platinum Sponsors of EuMW with the annual Welcome Reception at the Nuremberg Convention Centre, the record for the total number of unique delegates at European Microwave Week 2013 had been surpassed, backing up the unrivalled number of unique exhibiting companies demonstrating their latest innovations on the show floor.


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AWR announces AWR Connected for AMPSA

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), and AMPSA, supplier of RF and microwave amplifier design software, announce AWR Connected™ for AMPSA, a synthesis-through-simulation design flow specifically developed to improve design throughput and productivity for amplifier designers.


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Laird showcasing ECCOSORB and ECCOSTOCK products at EuMW 2013

Laird, a global technology company, announced it will attend European Microwave Week (EuMW), the largest microwave and radio frequency (RF) tradeshow in Europe. Laird will showcase ECCOSORB® and ECCOSTOCK® products and solutions for wireless and satellite communication, military and aerospace, automotive, medical and RFID markets. EuMW will take place October 8 through 10 in Nuremberg, Germany at the Nürnberg Convention Center. Laird will participate in the exhibition portion of the event and exhibit at booth #140.


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Richardson RFPD at IEEE COMCAS 2013

Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.


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Pulse Electronics introduces ultra-thin NFC antenna for mobile devices

Pulse Electronics Corp., a leading provider of electronic components, introduces an ultra-thin near field communications (NFC) ferrite sheet antenna. The antenna is 28 percent thinner than the previous version and still meets the EMVCo specification of 40 mm. It enables NFC connectivity to mobile devices for payment sharing, credential storage and exchange, accessing and controlling data, and wirelessly connecting to tags.


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