RF & Microwave Industry News

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By the time that Agilent Technologies celebrated its tenth year as Platinum Sponsors of EuMW with the annual Welcome Reception at the Nuremberg Convention Centre, the record for the total number of unique delegates at European Microwave Week 2013 had been surpassed, backing up the unrivalled number of unique exhibiting companies demonstrating their latest innovations on the show floor.

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), and AMPSA, supplier of RF and microwave amplifier design software, announce AWR Connected™ for AMPSA, a synthesis-through-simulation design flow specifically developed to improve design throughput and productivity for amplifier designers.

Laird, a global technology company, announced it will attend European Microwave Week (EuMW), the largest microwave and radio frequency (RF) tradeshow in Europe. Laird will showcase ECCOSORB® and ECCOSTOCK® products and solutions for wireless and satellite communication, military and aerospace, automotive, medical and RFID markets. EuMW will take place October 8 through 10 in Nuremberg, Germany at the Nürnberg Convention Center. Laird will participate in the exhibition portion of the event and exhibit at booth #140.

Computer Simulation Technology AG (CST) previewed the latest version of its flagship electromagnetic simulation tool, CST STUDIO SUITE® 2014, at European Microwave Week 2013.

Altium Ltd., a global leader in Smart System Design Automation, 3D PCB design (Altium Designer) and embedded software development (TASKING) announces the promotion of Martin Harris to chief sales officer (CSO).

Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.

Pulse Electronics Corp., a leading provider of electronic components, introduces an ultra-thin near field communications (NFC) ferrite sheet antenna. The antenna is 28 percent thinner than the previous version and still meets the EMVCo specification of 40 mm. It enables NFC connectivity to mobile devices for payment sharing, credential storage and exchange, accessing and controlling data, and wirelessly connecting to tags.

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced that it has commenced high-volume production of multiple new power amplifiers (PAs) and power management integrated circuits (ICs) that incorporate RFMD's envelope tracking (ET) technology.