RF & Microwave Industry News

TEGAM patents innovative microwave bolometer design

TEGAM Inc., a leading supplier of innovative RF power measurements, was recently awarded Patent No. 8,610,069, “Coaxial to Dual Co-Planar Waveguide Launcher for Microwave Bolometry,” This patent describes a new way to construct bolometers—a type of microwave power sensor that uses thermistors—that makes them more accurate and easier to assembly.


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ADI unveils SDR platform solutions

RFIC

Analog Devices Inc. announced two software-defined radio (SDR) platform solutions and ecosystems. This brings its portfolio to four platform solutions that simplify rapid SDR system prototyping and development in applications ranging from defense electronics, RF instrumentation, communications infrastructure and open-source SDR development projects.


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The new R&S RTE oscilloscopes offer ease of use and powerful analysis

The new R&S RTE from Rohde & Schwarz is available with bandwidths from 200 MHz to 1 GHz. An acquisition rate of more than one million waveforms per second helps users find signal faults quickly. The scope's highly accurate digital trigger system with virtually no trigger jitter delivers highly precise results. The single-core A/D converter with more than seven effective bits (ENOB) almost completely eliminates signal distortion.


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TI and PureWave Networks develop solutions platform for enterprise and pico cell base stations

Texas Instruments (TI) and PureWave Networks Inc., an innovative provider of advanced, cost-effective wireless base stations, announced their collaboration on a first-of-its-kind single-board, end-to-end (ENET to RF) solution platform for enterprise and pico small cell base stations. The Hercules solutions platform utilizes TI's highly-integrated KeyStone™-based TCI6630K2L System-on-Chip (SoC), combined with TI's analog front end transceiver, the AFE7500, allowing customers to demonstrate 4G cellular functionality and performance right out of the box. 


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Molex showcased NeoScale high-speed mezzanine system at DesignCon

Molex Inc. announced its NeoScaleTM High-Speed Mezzanine System at DesignCon 2014.  Delivering remarkably clean signal integrity at data rates of 28+ Gbps, the modular mezzanine interconnect is designed for high-density printed circuit board (PCB) mezzanine applications with limited PCB real estate.  Industry applications include enterprise networking towers, telecommunication hubs and servers, industrial controllers, and medical and military high data-rate scanning equipment.


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