RF & Microwave Industry News

Focus on Signal Integrity and High Speed Digital Design in Technical Conference and Workshops at EDI CON 2014

Signal integrity engineers and high speed digital engineers of multi-gigabit links are experiencing design challenges often associated with microwave frequencies. As a result, test instrument and simulation software vendors are providing solutions to tackle high speed channel characterization and design. The EDI CON technical tracks have been expanded in 2014 to include a new dedicated signal integrity, high-speed digital and EMC/EMI modeling/measurement track featuring papers on the challenges facing high-speed digital designers at the chip, package and board levels. The added HSD/EMC measurement and modeling track will take place on Thursday morning, April 10th. This track comprised of eight, 20 minute peer-reviewed presentations will complement related papers in the design tracks and various afternoon workshops held throughout the entire conference.


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Comtech Telecommunications Corp. awarded $1.4M for high-power amplifiers

Comtech Telecommunications Corp. announced that its Santa Clara, California-based subsidiary, Comtech Xicom Technology, Inc., has been awarded a contract totaling $1.4 million from a major system integrator to supply rack-mount, high-power amplifiers ("HPAs"). The HPAs will be used in an expansion of a system that relays military satellite communications around the world and that is already using similar Comtech Xicom HPAs.


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Frequency Matters, Feb 10, 2014

RF/microwave Industry Update

Frequency Matters 6Watch episode 6 (Feb 10, 2014) of the bi-weekly industry update video series, Frequency Matters. Editors David Vye and Pat Hindle host the show covering RF/microwave news, events and technical content. Catch up on the latest happenings in the industry.


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