RF & Microwave Industry News

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Airbus Defence and Space has signed a four year framework agreement with the Norwegian Defence Logistic Organisation for the provision of X-band satellite capacity.

In another industry first, Passive Plus Inc. now performs 100 percent partial discharge testing on all leaded capacitors. This added capability continues to enhance the reliability of Passive Plus capacitors for demanding high voltage applications.

Silicon Labs unveiled a dual-mode Bluetooth® Smart Ready module solution that gives embedded developers unparalleled flexibility to integrate both Bluetooth Smart and Bluetooth Basic Rate/Enhanced Data Rate (BR/EDR) wireless technologies while minimizing design time, cost and complexity.

Tektronix, a leading manufacturer of oscilloscopes, and The Institute of Electronics, Microelectronics and Nanotechnology (IEMN), a major French research laboratory, announced the world’s first demonstration of a world record breaking wireless system capable of transmitting data at 400 GHz (0.4 THz) using advanced signal coding (up to QAM-16) and key advanced THz devices.

ABI Research estimates that there will be nearly 1.37 billion 4G LTE subscribers worldwide by year-end 2015, up from nearly 650 million in 2014. ABI Research forecasts that the LTE subscriber base will exceed 3.5 billion by 2020, demonstrating a 5 year CAGR of 20.8%. The exponential rise in LTE points-of-presence covered justifies the need for sustained investment in LTE infrastructure, which is expected to grow nearly 10% year-on-year.

Anokiwave Inc., an innovative provider of highly integrated core IC solutions for mmWave and AESA markets,  announced the latest addition to its leadership team with the appointment of Carl Frank to the position of vice president of business development. This appointment comes at a time of strategic expansion for Anokiwave.

Teseq introduces two high voltage artificial networks designed for conducted emission tests and line termination during susceptibility tests for components. The HV-AN 150 and HV-AN S150 are both ideal for use in automotive, military and airborne standards applications.

TE Connectivity (TE), a world leader in connectivity, announces its new Fortis Zd LRM connector system, an innovative modular connector system for rugged, next-generation packaging from avionics boxes to military ground vehicles. It features a rugged, lightweight multi-bay shell that accepts high-speed digital signal, power, radio-frequency (RF) and optical modules.

On June 12, TMD Technologies Ltd. celebrates its 20th anniversary since founders Peter Butcher and Howard Smith undertook an MBO (Management Buy-out) in 1995 from Thorn EMI Electronics.