RF & Microwave Industry News

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Coilcraft has released two new series of surface mount planar transformers for power over Ethernet (PoE) and -48V network power applications. The PL160 Series is rated for 160 Watts between 200 kHz and 700 kHz with a nominal 48 V input, and the PL300 Series is rated to 300 Watts.

Isola Group S.à r.l., a market leader in engineered dielectric materials used to fabricate advanced multilayer printed circuit boards (PCBs), announced that the company has launched a technology-licensing program to mitigate conductive anodic filamentation (CAF) problems in the fabrication of PCBs. This proprietary manufacturing technology, which is offered by ISOLA USA Corp. 

Ultra low power (ULP) RF specialist Nordic Semiconductor ASA announces S110 SoftDevice v7.0, the next major release of its Bluetooth® low energy stack, for the nRF51822 Bluetooth low energy and 2.4GHz proprietary System-on-Chip (SoC) and the nRF51422 ANT™ and ANT/Bluetooth low energy multiprotocol SoCs.

Cree has added four new gallium nitride (GaN) high electron mobility transistors (HEMTs) to its product portfolio at Digi-Key, the sole distributor for Cree RF components. Respectively based on Cree’s high power density 50V, 0.25μm and 0.4μm GaN on silicon carbide (SiC) foundry processes, the new X-Band and S-Band components exhibit high efficiency, high power gain, and wide bandwidth capabilities.

Inmarsat, the leading provider of global mobile satellite communications services and Rockwell Collins, a pioneer in communications, aviation electronics and information management, have signed a Memorandum of Understanding to make Rockwell Collins a Value Added Reseller (VAR) of GX Aviation Ka-broadband service.  

XMA Corp., the industry leader in Microwave and RF component technology, announced the release of their new product family of 1.85mm attenuators, adapters, and terminations, expanding performance into the 65GHz, millimeter wave market.  Technical advancements within the smart phone industry, as well as aerospace, medical and Defense, are driving manufacturers and carriers of wireless devices to push for performance into the higher frequency bands.  

AWR will be presenting and demonstrating its soon-to-be released V11 NI AWR Design Environment™ at EDI CON 2014 in Beijing, China starting April 8 and running through April 10, 2014.  V11, the first major software release in 2014, includes new features, functionality and enhancements to Microwave Office®/Analog Office® circuit design software, Visual System Simulator™ (VSS) system design software, AXIEM® 3D planar electromagnetic (EM) software, and Analyst™ 3D finite element method (FEM) EM software. Demonstrations within booth #301 will showcase V11 new features and functionality and in particular the new user-customizable PCell capability and antenna measurements within Analyst.

Harris Corp., an international communications and information technology company, has received $49 million in orders to provide a nation in Asia with enhanced tactical communications and field support.

Richardson RFPD Inc. announces that it is accepting orders for two new solutions for simplifying next generation Doherty architecture.

TJ Green Associates LLC announced it will be offering a three day microwave packaging technology course in Boston, May 7-9th.