RF & Microwave Industry News

TriQuint drives LTE advances with a growing line of high-performance filters

TriQuint Semiconductor Inc., a leading RF solutions supplier and technology innovator, announced several new premium filters for next-generation smartphones and other mobile devices. The high-performance filters utilize the company’s advanced acoustic wave filtering technologies to address some of the industry’s toughest LTE interference problems.


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Agilent simulation & modeling software selected by Nitronex for high-power GaN design

Agilent Technologies Inc. announced that Nitronex, a GaAs labs company and leading producer of GaN-on-silicon RF power devices, has selected Agilent to provide a complete GaN design flow that spans both device modeling and circuit simulation. The flow uses Agilent EEsof EDA’s IC-CAP model extraction software and Advanced Design System (ADS) circuit and system simulator—both market-leading platforms in RF and microwave design.


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Molex introduces electromagnetic interference absorption tape and sheets

Molex Inc. launched its innovative HOZOX™ Electromagnetic Interference (EMI) Absorption Tape and Sheets, ideally suited for manufacturers of high-frequency equipment in multiple industries, including medical, consumer electronics, data/telecommunications and microwave/radio frequency.  HOZOX absorption technology utilizes a unique dual-layer design to maximize the EMI noise mitigation performance.  .


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RFS promotes Al Filoreto to eastern regional sales manager

Radio Frequency Systems (RFS), the global wireless and broadcast infrastructure specialist, announced that wireless industry veteran and long-time RFS team member Al Filoreto has been promoted to eastern regional sales manager. In his new role, Filoreto’s top priorities are to widen and diversify the company’s customer base and to increase RFS’ brand name recognition in the market.


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EDI CON 2014 Announces RF and High Speed IC Design and EDA in China Panel

As a result of China’s relatively short-term experience in IC design, the country’s current state of indigenous IC design capability is limited by several factors including limited self generated core-IP and a generally weak knowledge of IC foundries and necessary EDA infrastructure. These new fabless IC design centers, many of whom have been in existence for less than 10 years, face a number of challenges specific to EDA use. Many enterprises have yet to establish proper CAD support departments and efficient EDA design flows. Young design engineers and CAD support teams often do not fully understand and utilize existing process design kits (PDKs) and parameterized active (transistor) and passive models. Investment in specialized EDA tools such as RF/microwave and high-speed circuit analysis, parasitic extraction, LVS/DRC and yield optimization is significantly lower than the level of investment made by design centers in North America and Europe.


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