RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has successfully completed a recently announced expansion of its test, tape and reel, and assembly facility, located in Beijing, China. In addition to newly qualified internal assembly capacity for power amplifiers (PA), switch-based products, and antenna control solutions, RFMD is also qualifying advanced flip chip capabilities for its 2G, 3G, and 4G LTE and TD-LTE products.