In many microwave applications above 10 GHz, ribbon wire bonding is usually used because of its high frequency and high power characteristics. In general, ribbon bonding with a rectangular-shaped wire will provide lower impedance and inductance at high...
Wire bonding is the most common interconnect method for providing the interconnection between an integrated circuit (IC) and a printed circuit board (PCB), IC-to-IC, or PCB-to-PCB. The two main wire-bonding technologies are ball bonding and wedge bonding. Although ball bonding is faster and much more popular, wedge bonding offers...
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