RF & Microwave Industry News

Silicon Labs acquires Energy Micro

Silicon Labs, a leader in high-performance, analog-intensive, mixed-signal ICs, has signed a definitive agreement to acquire Energy Micro AS based in Oslo, Norway, the late-stage privately held company that offers a power-efficient portfolio of 32-bit microcontrollers and is developing multi-protocol wireless RF solutions.


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Hesse Mechatronics debuts dual-head wedge bonder in the Americas

Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.


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Skyworks captures strategic automotive design wins: MTT-S 2013

Skyworks Solutions Inc., an innovator of high performance analog semiconductors enabling a broad range of end markets, announced that an increasing number of its products are enabling telematics and infotainment systems in the automotive market.  Telematics is the term used to describe the integrated use of computers and electronic technology in automobiles for wireless communication applications such as cell phones, the Internet and GPS receivers.


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AVX intros low-profile 0603 MLO diplexer for multiband apps

AVX Corp. announced its new low-profile 0603 diplexer at the International Microwave Symposium in Seattle, WA.  Based on the company’s patented multilayer organic high density interconnect technology, the new 0603 MLO™ diplexer employs high dielectric constant and low loss materials to realize high Q passive printed elements, such as inductors and capacitors in a multilayer stack up.


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