Articles Tagged with ''power''

Analog Devices Inc. introduced a new family of microwave ICs, the ADF55xx series voltage controlled oscillators (VCOs), for point-to-point (PtP), instrumentation/ test equipment and satellite communication applications. Featuring the industry’s leading phase-noise performance, the new ADF55xx VCO series covers a frequency range from 3.5 GHz to 13.9 GHz, offers a wide frequency tuning range and can be optimized for power consumption, phase noise and power output.

Linear Technology Corp. introduces three low power 16-bit, 20Msps analog-to-digital converters (ADCs), the LTC2269, LTC2270 and LTC2271, offering the lowest input-referred noise and tight integral nonlinearity error (INL) for very high precision DC measurements. With only 46µV_RMS input noise and maximum guaranteed INL error of ±2.3LSB, these ADCs are suitable for very low noise, high linearity sampling applications such as digital x-ray, infrared and medical imaging, pachymeters, spectrometry and cytometry.

Florida RF Labs has added broadband resistive power dividers to the HybriX® line of signal distribution products. The new RPD series offers significant advantages over on-board multi-resistor design by providing excellent broadband frequency response, highly repeatable performance, and streamlined assembly process in a monolithic surface-mountable chip package.

Cree Inc. and Array Wireless help bring the clarity of high-definition (HD) video transmission to Sunday Night Football (SNF) on NBC. The HD NFL games are broadcast using wireless video systems from Array Wireless that employ Cree’s advanced GaN RF components. Array Wireless counts on Cree world-class RF GaN technology to create high efficiency, low distortion, robust power amplifiers that are essential for high-definition video transmission.

ERZIA Space´s line of products, especially focused on power amplifiers, will be presented during the 15th edition of the European Microwave Week. Visit the company at Stand 302.

TriQuint Semiconductor Inc. has introduced three new devices for CATV infrastructure and fiber to the premises (FTTP) applications, including the industry’s first amplifier supporting return path DOCSIS® 3.0 channel bonding with 5 to 300 MHz bandwidth.

Nujira Ltd., the world leader in envelope tracking (ET) technology, has announced that is sampling its next generation ET IC for mobile handsets, the NCT-L1200, to lead partners. The second product in its Coolteq.L ET product family, Nujira’s NCT-L1200 has already been delivered to several key platform chipset vendors, and is the only product currently available on the market that supports the maximum 20MHz channel bandwidth of LTE.

Aethercomm Inc., has recently completed a high power SSPA using a Gallium Nitride (GaN) with a frequency range covering 2.9 to 3.1 GHz: Aethercomm part number SSPA 2.9-3.1-300. The devices in this amplifier design are not matched, therefore the frequency band is scalable from 2.7 to 2.9 GHz or 2.7 to 3.5 GHz with similar performance. This high power SSPA produces 300 to 400 watts peak output power.

Linear Technology’s Dust Networks® product group introduces the SmartMesh™ LTC5800 (system-on-chip) and LTP5900 (module) families, the industry’s lowest power IEEE 802.15.4E compliant wireless sensor networking products. SmartMesh ICs and modules enable tiny sensor “motes” to be designed with a battery life of over 10 years, while companion network manager components enable the development of highly robust and secure wireless sensor networks (WSN).

Agilent Technologies Inc.  unveiled ADS 2012, the next major release of its Advanced Design System (ADS) flagship RF and microwave EDA platform.