Articles Tagged with ''packaging''

Michael Casper, president & CEO of UltraSource Inc., a thin film ceramic microchip manufacturer is pleased to announce that UltraSource Inc. is featured in the publication titled “Microwave and Millimeter-Wave Electronic Packaging” by Rick Sturdivant and published by Artech House.

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 

Remtec Inc., the leading manufacturer of substrates and packages using Plated Copper on Thick Film (PCTF®) metallization, has appointed William F. Dinardo to the new position of business development manager.

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.

Nujira Ltd.has selected ASE as its production packaging and test partner for its Coolteq.L family of High Accuracy Tracking Envelope Tracking ICs.

KCB Solutions is pleased to announce a suite of MIL-STD certified products and services for the military, aerospace, and defense market. They’ll be exhibiting in booth #1610 at the International Microwave Symposium in Seattle, WA June 4-6th. Senior staff will be on-hand to answer questions about KCB’s leading edge semiconductor packaging services, manufacturing services and recently launched standardized and fully-screened components.

Santier, a leading custom electronic packaging manufacturer, announced the hiring of Kevin Cotner as chief operating officer. Cotner will manage Santier’s sales, manufacturing and procurement departments. He will report to Vim Dutt, Santier’s president and CEO.

Development of a low cost, compact integrated Passive Device technology including process description and example devices