Articles Tagged with ''software''

Texas Instruments Inc. (TI), leading the industry with the most complete wireless connectivity portfolio for embedded applications, announced the extension of its remote control solutions offering with a new Bluetooth® low energy advanced remote control kit. As a technology, Bluetooth low energy allows for remotes with mouse-like pointing and keyboard functionality as well as gesture-, touch- and motion-based input controls so users can take their viewing and gaming experience to the next level.

X-COM Systems LLC, a subsidiary of Bird Technologies Group, introduced the IQC5000A Series RF Spectrum Capture and Playback System, the smallest, lightest, best-performing system available for the capture and playback of RF and microwave signals over short or long time spans for mission-critical applications.

AWR’s new application note titled, "Multisim/Ultiboard for Low-Frequency Simulation and Layout" details how to complement Microwave Office® circuit design software with NI’s Multisim circuit simulation software and Ultiboard printed circuit board (PCB) layout software for a comprehensive design flow.

Computer Simulation Technology AG has announced the incorporation of its office in Bengaluru, India.

Maxim Integrated Products Inc. announced the MAX2173 RF to Bits tuner for digital audio broadcast (DAB) applications in automobiles and other mobile DAB/FM products. The industry’s first RF to Bits DAB/FM tuner integrates a radio tuner, analog-to-digital converter (ADC), and digital filtering, and uses a digital I2S output to interface directly to digital signal processors (DSPs).

Agilent Technologies Inc. announced that Plextek RF Integration, a UK-based  company that designs and develops RFICs, MMICs and microwave/millimeter-wave modules, has selected Agilent software to simulate its new high-frequency circuit and MMIC designs.

AWR Corp., the innovation leader in high-frequency EDA software, announces that it will continue to offer its popular Graduate Gift Initiative to graduating engineering students worldwide for a record fourth consecutive year.

Tektronix Inc. announced the industry’s first demonstration of a M-PHY test solution for silicon-proven HS-Gear3 IP, a key part of the MIPI Alliance M-PHY physical layer specification for mobile devices. The Tektronix test solution allows designers to quickly and efficiently characterize designs and verify performance.

AWR Corp. announces the addition of two new stories to its roster of university student and professor design successes using AWR software. These new stories include contributions from Okinawa National College of Technology in Japan and Macquarie University in Australia.

Answering the growing need for smartphone and tablet applications that update seamlessly, Texas Instruments Inc. (TI) announces a truly wireless solution with a unique over-the-air-download (OTA or OAD) feature in its BLE-Stack™ 1.3 software for use with the CC2540 and CC2541 Bluetooth low energy system-on-chips (SOCs). Single-mode Bluetooth® low energy or Bluetooth Smart is increasing in popularity because it allows consumers to connect to their smartphones and tablets to  automotive, home office, medical and health, sports and fitness as well as mobile and PC accessories.