AVX Corp., a leading manufacturer of passive components and interconnect solutions, has introduced a new series of Schottky barrier rectifier diodes uniquely packaged as lead-less chips. Eliminating the standard lead frame wire bond provides the chip with top-bottom symmetry, which enables better heat transfer, better current handling capability than SOD devices, and fewer mounting problems. Available in several case sizes and a range of current values spanning 0.1A to 8A, the new lead-less chip form Schottky rectifier diodes are ideal for applications including switch mode power supplies, high frequency rectification, portable battery powered devices, and reverse bias protection.
SemiGen Inc., an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, offers PIN diodes that feature low capacitance and resistance, high reliability, and easy bonding with F.A.C. mesas. These devices are typically manufactured with either a robust thermal-oxide passivation or ceramic glass for durable high-power applications. These diodes are made with a grown junction P++ layer that yields abrupt junction structures.
Richardson RFPD Inc. announced it has completed an agreement to distribute Silicon Carbide power products from Cree Inc. Under the agreement, Richardson RFPD will distribute Cree's SiC Schotty diodes, MOSFETs and power modules worldwide.