Articles Tagged with ''assembly''

Isola Group S.à.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multilayer Printed Circuit Boards (PCBs), announced TerraGreen, the company’s new halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations, internet infrastructure and cloud computing.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has successfully completed a recently announced expansion of its test, tape and reel, and assembly facility, located in Beijing, China. In addition to newly qualified internal assembly capacity for power amplifiers (PA), switch-based products, and antenna control solutions, RFMD is also qualifying advanced flip chip capabilities for its 2G, 3G, and 4G LTE and TD-LTE products.

San-tron Inc., a leading RF coaxial connector and cable assembly manufacturer, announces a video describing the features of its high-performance eSMATM connector line.

Fox Electronics, a leading global supplier of frequency control solutions and an IDT company, now offers the FTM Series of surface mount OCXOs that is ideally suited as the timing reference for network synchronization.

Proper installation of RF connectors onto coax cable is critical in wireless system performance. Two new N male connectors simplify the installation process by eliminating the need to trim the braid during cable preparation. The RFN-1006-49I features a solderless captive pin and the RFN-1006-4I features a crimp pin.

Laser Services Inc., an ISO and AS9100 registered laser job shop, has released a video that shows its innovative approach to servicing engineers, designers, and operations managers with expert laser cutting, drilling, marking, etching, ablating, and welding services. The video provides insights on how to best employ Laser Services as an outsource and covers their full breadth of capabilities from prototyping to volume assembly.

Vishay Intertechnology Inc. extended its VJ X8R series of surface-mount multilayer ceramic chip capacitors (MLCCs) for high-temperature applications. To save board space, the devices are now offered in the 0402 case size. In addition, the 0603 and 0805 case sizes have been enhanced with a higher voltage rating of 100 V. 

Molex Inc. recently launched an online RF Assembly Builder for distributors, customers and prospective customers. Available now at www.molex.com/molex/family/RF_Configurator.jsp, the free configurator tool simplifies the design process and allows the user to build a complete assembly and instantly submit an RFQ, without downloading any application or software.

Molex Inc. announced that it will exhibit at the IEEE 2013 International Microwave Symposium (IMS) in Seattle, WA, June 2-7.   Molex will showcase its broad range of products and solutions available for the RF/microwave market, including several new products and live product demonstrations, in booth 719.