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InstaBend 141 provides a larger-diameter, lower loss addition to Times Microwave’s Systems InstaBend family of microwave assemblies, which feature a flexible preassembled design for interconnects between RF circuit cards, modules and enclosure panels.
ECT switch probes are cost effective and reliable solutions for non-destructive testing to verify the presence of components or contact leads within a connector assembly.
SemiGen, Inc. an ISO and ITAR registered RF/Microwave assembly, automated PCB manufacturing, and RF Supply Center, has released a technical brief shedding light on the benefits to RF/Microwave OEMs in partnering with a US-based contract manufacturer.
W. L. Gore & Associates introduced an online tool designed to complement the existing GORE™ Microwave/RF Assembly Builder. The new GORE™ Microwave/RF Assembly Calculator is used to calculate insertion loss, VSWR and other parameters of GORE® Microwave/RF Assemblies for different cable types. The calculator is particularly useful when the initial cable type is unknown and needs to be specified independent of the connector.
Global connectivity leader HUBER+SUHNER continues to establish its expertise at the International Microwave Symposium in San Francisco, 22-27 May 2016, exhibiting a range of new products including SUCOFLEX 500V VNA test assemblies, Microbend L, SUCOFLEX 126 and its RF/GPS/LAN-over-Fiber Series, which combine radio frequency and fiber optics in one system.
SemiGen Inc., an ISO and ITAR registered RF/microwave assembly, automated PCB manufacturing and RF Supply Center, has launched a new website. The site features updated RF/microwave testing/assembly/design, PCB assembly, semiconductor upscreening and RF/microwave module repair pages with detailed parameter and specification listings.
Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.
Zentech Manufacturing is pleased to announce that Greg Rodgers has joined the Zentech Manufacturing Inc. team as director, business development/Delaware Valley Region.
W. L. Gore & Associates introduced an online tool designed to complement the existing GORE™ Microwave/RF Assembly Builder. The new GORE™ Microwave/RF Assembly Calculator is used to calculate insertion loss, VSWR and other parameters of GORE® Microwave/RF Assemblies for different cable types. The calculator is particularly useful when the initial cable type is unknown and needs to be specified independent of the connector.