Articles Tagged with ''wafer''

Qorvo Inc., a leading provider of core technologies and RF solutions for mobile, infrastructure and aerospace/defense applications, announced it has successfully scaled its proprietary QGaN25 gallium nitride (GaN) on silicon carbide (SiC) process to produce monolithic microwave integrated circuits (MMICs) on six-inch wafers. The transition from 4-inch to 6-inch wafers is expected to approximately double Qorvo's GaN on SiC manufacturing capacity and favorably impact manufacturing costs – significantly accelerating the affordable manufacture of RF devices.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the UltraCMOS® 11 platform, the industry’s first RF SOI technology built on GLOBALFOUNDRIES’ 130 nm 300 mm RF technology platform.

WIN Semiconductors Corp., the world’s largest pure-play compound semiconductor foundry, announced that it has surpassed 1 million cumulative wafer shipments to customers in the mobile PA, Wi-Fi, wireless infrastructure and optical markets.

United Microelectronics Corp. (UMC) and Fujitsu Semiconductor Ltd. have announced an agreement for UMC to become a minority shareholder of a newly formed subsidiary of Fujitsu Semiconductor that will include its 300 mm wafer manufacturing facility located in Kuwana, Mie, Japan.

RFMD, a global leader in the design and manufacture of high-performance radio frequency solutions, announced it has signed a $9.7 million agreement with the Manufacturing and Industrial Technologies Directorate within the Air Force Research Laboratory (AFRL) to transfer and produce a 0.14 micron Gallium Nitride (GaN) monolithic microwave integrated circuit (MMIC) technology. The technology will be scaled to 6-inch diameter wafers using RFMD's industry-leading 6-inch GaN-on-Silicon Carbide (SiC) manufacturing line.

Sonoscan announces its enhanced Digital Image Analysis Toolbox™ used for automated acoustic analysis of individual IC components, various types of bonded wafers including MEMS devices, and other devices.

Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has acquired the assets and intellectual property of Group4 Labs Inc. (Group4), a semiconductor wafer materials company that manufactured Gallium Nitride (GaN) on-diamond semiconductor technology for RF and high-power devices.

As the result of joining forces within the HiTeK project to combine the advantages of silicon-based CMOS circuits from the IHP with those of indium-phosphide circuits from the FBH, the partners have successfully integrated both circuits on a semiconductor wafer.

Hesse & Knipps Inc., (www.hesse-knipps.com) the Americas subsidiary of Hesse & Knipps Semiconductor Equipment GmbH, has appointed Allan Camp as technical training manager.