Articles Tagged with ''thermal''

Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.

Richardson RFPD Inc. announces immediate availability and full design support capabilities for a new diffused metal oxide semiconductor (DMOS) transistor from STMicroelectronics (ST).

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.

Custom MMIC, a developer of performance-driven monolithic microwave integrated circuits (MMICs), is introducing a free, easy-to-use, Thermal Analysis tool to their array of web-based calculators. The company offers Attenuator, Image Rejection, Cascade Analysis, and now Thermal calculators.

Molex Inc. will present leading edge high-speed, high-density solutions at the 39th European Conference on Optical Communication (ECOC 2013) being held September 22-26 at the ICC London ExCEL, England.  ECOC is the largest European optical communications event for the fiber optic industry.

DiTom Microwave has received a contract from a major U.S. satellite manufacturing company for thermal vacuum (TVAC) compatible X- and Ka-Band isolators. Under the contract agreement, DiTom will supply ferrite isolators for the Wideband Global Satcom (WGS) program. 

Isola Group S.a.r.l., a market leader in copper-clad laminates and dielectric prepreg materials used to fabricate advanced multi-layer Printed Circuit Boards (PCBs), announced its new low loss, low skew, high-speed material, GigaSync™. This product has been engineered to eliminate skew issues in high-speed designs that use differential pairs to create a balanced transmission system able to carry differential (equal and opposite) signals across a printed circuit board. 

At SEMICON West 2013, Element Six, the world leader in synthetic diamond supermaterials and member of the De Beers Group of Companies, announced it has expanded its global manufacturing capabilities of microwave chemical vapor deposition (CVD) synthetic diamond by 60 percent compared to last year.

Following the success of the Diamond RF Resistives® product range, EMC Technology now offers CVD Diamond Heat Spreaders designed to meet today’s demanding requirements for higher power and longer life spans by keeping junction temperatures low and stable. CVD Diamond provides up to 8x the thermal conductivity of traditional materials like AlN and BeO.