Transline Technology, an innovative provider of advanced printed circuit board (PCB) solutions, announces its participation in the International Microwave Symposium (IMS) 2024, to be held at the Walter E. Washington Convention Center in Washington, DC. Transline will be located at Booth #733 during the exhibition, scheduled from June 18-20, 2024.

With a rich legacy of innovation and expertise, Transline Technology is renowned for its pioneering work in RF/microwave and mmWave PCB technology. The company's participation at IMS 2024 underscores its commitment to working closely with world class companies to bring cutting edge technologies to the marketplace.

Transline Technology will be leveraging their participation in IMS 2024, and this international platform to showcase its unique proficiency in manufacturing metal-backed PCBs. These type of PCBs offer superior thermal performance and reliability, which cater to the evolving demands of high frequency applications in industries such as telecommunications, aerospace, defense and beyond.

"We are thrilled to be exhibiting at IMS 2024 again this year, and look forward to sharing our latest advancements in RF/ microwave and mmWave PCB manufacturing," said Chris Savalia, CEO at Transline Technology. "Our strong focus on high frequency applications allow us to deliver solutions that empower our clients to push the boundaries of technology."

Attendees visiting booth #733 will have the opportunity to engage with Transline's team of experts, who will provide insights into the company's capabilities and discuss how their metal-backed PCBs can address specific project requirements.

IMS 2024 serves as a premier gathering for professionals and organizations at the forefront of microwave and RF technologies. With an extensive exhibition, technical sessions and networking opportunities, the event facilitates collaboration and knowledge exchange among industry leaders and innovators.