Figure 1 Evolving role of AESA arrays and radar.
Radar plays an expanding role with wide-ranging applications in the world today. Many defense contractors are developing active electronically scanned array (AESA) technologies for mission-critical systems in support of radar, EW, missile/munitions, space, communication, navigation and IFF (CNI) applications. These technologies can be found on major platforms in diverse environments: from destroyers and missile defense radar systems to space deployments in GPS, AEHF, Iridium Next, Orion, the Mars rover and the International Space Station (see Figure 1). Through advanced ICs and packaging, miniature multi-mode custom arrays can offer customers a new set of capabilities with “aperture to data” to support the U.S. military in today’s environment of evolving threats to enable enhanced performance at lower cost and simple implementation.
The U.S. DoD must leverage historical technology and embrace new commercial technologies against advancing security threats. Investments in phased array and multiple inputs multiple outputs (MIMO) radar technologies - along with underlying IC and packaging technology - are required to meet demanding threat detection requirements. Today’s solutions must be affordable and capable of rapid deployment. Solutions for these radar products are built upon highly integrated system-on-a-chip (SoC) custom ICs and MMICs along with advanced packaging and integrated subsystem products for applications in the aerospace and defense market. Unique combinations of differentiated technology aggregated with advanced packaging and automation is making it possible to build small lightweight integrated AESA solutions.
Advanced technology integration is required to be an integrated solution provider from aperture to data. New technology roadmaps coupled with close relationships with fielded applications offer a fresh new look at the AESA technologies. It is critical to offer cutting-edge sensor technologies in partnership with system providers to deliver solutions aligned with program needs and the needs of our warfighters. Advanced packaging of SoC solutions with fully integrated subsystems widens opportunities to deliver a strategically important supply to defense primes and key subsystem providers (see Figure 2).
Figure 2 Vertical integration needed for small mmWave AESA.
Circuit loss and performance come at a premium when operating in the mmWave frequency range. Recent FCC news regarding the multi-billion dollar bids for mmWave frequency bands along with expansive 5G rollout indicate long term technology development. Connector and waveguide technologies are improving to support the growing need for and uses of mmWave frequency expansion. Leveraging long-standing RF expertise, defense contractors can now offer broad solutions and capabilities including antenna systems, transmit/receive (T/R) electronics and beam-formers, up/down converters, digitizers, interconnects and positioners. Utilizing advanced packaging technologies, digital and direct conversion technologies have become part of the signal chain. The result is a unique integration of the complete signal chain into an integrated mmWave solution with higher power, wider bandwidth and high reliability in austere environments. Integration lowers size, weight, power and cost while meeting stringent application requirements for highly sensitive solutions with optimum probability of detection.
