Items Tagged with 'integrated'

DEV Systemtechnik has launched a range of Distributed CCAP solutions to the European cable network market. The DOCSIS 3.1 compliant access node comes with complete CMTS functionality.

Qualcomm Inc. and TDK Corp. announced the completion of the previously announced joint venture under the name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings). The joint venture will enable Qualcomm’s RFFE Business Unit to deliver RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices and fast-growing business segments, such as Internet of Things (IoT), automotive applications, connected computing, and more. The business being transferred constitutes a part of the TDK SAW Business Group activities.

To address the need for radio systems that can adapt to changing environments on the fly and that can be easily reconfigured once in the field, BAE Systems has developed the MATRICS (Microwave Array Technology for Reconfigurable Integrated Circuits) chip.

MaxLinear Inc., a leading provider of RF and mixed-signal integrated circuits for cable and satellite broadband communications, the connected home, data center, metro, long-haul fiber networks and wireless infrastructure, announced the MxL3710, the world’s first fully integrated circuit (IC) to support the multi-gigabit Multimedia over Coax Alliance (MoCA®) 2.5 standard that provides at least 2.5Gbps of aggregate MAC throughput.

Noisecom, a Wireless Telecom Group company, announced a new CNG-EbNo programmable precision carrier-to-noise (C/N) generator with an integrated spectrum analyzer designed for communication systems data streams that include multiple carriers in the frequency band.

ASELSAN, a Turkish company with 40 years experience in defense electronics, is designing and developing 94 GHz, phased array and scalable SiGe integrated circuits that will be used as transmitter (Tx) and receiver (Rx) modules in civil radar systems.

NXP Semiconductors N.V. introduced the industry’s largest portfolio of broadband 28 V LDMOS two-stage, dual-path Doherty-optimized Integrated Circuits (ICs) for small cell base stations. As part of NXP’s leading RF power transistor portfolio, the new LDMOS ICs are designed to provide RF power, efficiency, and gain in all current and proposed frequency bands, from 700 to 3800 MHz, with RF output power of 2.5 to 12 W.

Haigh-Farr, a world leader in the design, development and manufacturing of integrated antennas for defense, space and commercial applications, will demonstrate its full range of antenna products at booth 402 at the DATT (Defense and Aerospace, Test and Telemetry) Summit 2016.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high-performance RF, microwave, millimeterwave and photonic semiconductor products, announced the MAOP-L284CN, a silicon photonic integrated circuit integrated with lasers (L-PIC™) for a 100G transmit solution for CWDM4 and CLR4 applications.

Linear Technology Corp. opened the company’s third semiconductor test facility in Singapore. The additional space for staff, equipment and materials will allow the company to more than double its production capacity of advanced analog circuits and µModule® (micromodule) products. This will strengthen Linear Technology’s ability to meet the growing demand for high performance analog integrated circuits worldwide.