Items Tagged with 'challenges'

The element14 community, in partnership with Texas Instruments(TI) and Plotly, announce the winning design of their “Internet of the Backyard” design challenge – a competition aimed at bringing Internet of Things (IoT) capabilities to everyday backyard appliances and devices.

TriQuint Semiconductor, Inc., announced that its specialty LowDrift™ and NoDrift™ fflter technology advancements are providing breakthrough performance by achieving unmatched temperature stability.

UC, Davis Chancellor, Linda Katehi will give the keynote address to the WAMICON 2014 audience on June 6, 2014 in Tampa, FL. WAMICON 2014 is co-located with IEEE MTT-S IMS and ARFTG at the Marriott Waterside Hotel and Marina.

Mentor Graphics Corp. announced that it has acquired Berkeley Design Automation Inc. (BDA), a recognized leader in nanometer analog, mixed-signal, and RF circuit verification. With over one hundred customers worldwide, BDA uniquely addresses nanometer circuit design challenges via its Analog FastSPICE™ unified verification platform and exceptional vertical-application expertise. The acquisition of BDA aligns with Mentor’s goal to deliver technologies with superior performance and automation for the growing challenges of Analog/Mixed-Signal (AMS) verification.

What does it take to make it to 80 years in an industry where today’s technology is obsolete tomorrow? For Indium Corp., it takes foresight and dedication.

Agilent Technologies Inc. announced it will show its newest wireless design and test solutions that address present and future test technology challenges in  LTE, LTE-A, and 3GPP, Releases 11 and 12, at Mobile World Congress, Feb. 24-27, Barcelona, Spain.

Peregrine Semiconductor Corp. announces the UltraCMOS 10 platform, the newest advancement in Peregrine’s UltraCMOS technology. UltraCMOS 10 RF SOI delivers both flexibility and unparalleled performance for addressing the ever-increasing challenges of RF front-end design.

At very high frequencies, signal propagation and transmission line effects on PCBs tend to happen earlier and become prominent. PCBs may also exhibit multiple resonances and power decoupling becomes more challenging than ever before. To overcome these challenges, PCB Designers and Engineers can count on the new EMSCAN EHX to verify the impact of rerouting signals or modifying PCB layout or materials used on the PCBs.

Peregrine Semiconductor Corp. announced it is expanding its family of MultiSwitch™ STeP8 dual single-pole, seven throw (SP7T/SP7T) UltraCMOS® antenna switches optimized to solve the significant carrier aggregation challenges of 4G mobile wireless applications.

Anritsu Co. announces the Toughest Site Competition 2013 that recognizes the challenges faced every day by field engineers and technicians responsible for deploying, installing, and maintaining wireless networks. The contest, which runs until June 30, 2013, highlights how field professionals overcome harsh weather conditions, extreme environments, and technical challenges to ensure the operation of private and commercial wireless networks.