Items Tagged with 'plastic'

RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.

Freescale Semiconductor,  the global leader in radio frequency (RF) power transistors, introduced the industry’s highest power RF power transistors housed in plastic packaging.

 MACOM Technology Solutions Inc., a leading supplier of high performance RF, microwave, and millimeter wave products announced the newest entry in its portfolio of GaN in Plastic power module products. 

Richardson RFPD Inc. announces that it is taking advance orders and offering full design support capabilities for a new family of 48 V gallium nitride-on-silicon (GaN-on-Si) RF power transistors from Nitronex.

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

M/A-COM Technology Solutions Inc. (“MACOM”), a leading supplier of high performance RF, microwave, and millimeter wave products, today announced the newest entry in its portfolio of GaN in Plastic packaged power products. Optimized for L-Band commercial air traffic control, military radar, and long range perimeter monitoring applications at 1.2 to 1.4 GHz, MACOM’s new 2-stage, fully matched GaN in Plastic power module scales to peak pulse power levels of 100W in a 14 x 24 mm package size – delivering twice the power of comparably sized competing products.

LPKF is one of the leading global suppliers of laser welding systems for plastics. This product area has been growing rapidly for a number of years. Revenue growth was hindered recently due to capacity bottlenecks at the location of Erlangen.This week the board of directors of the LPKF Group sealed the planned move to a new production and office building by signing a purchase contract. At around 10,000 m² the new premises in Fürth is more than twice as big as the previous location and offers further potential for expansion.

MACOM introduced its series of GaN in Plastic packaged power transistors for high-performance civilian and military radar and communications systems. They scale to peak pulse power levels of 100 W – the highest among competing components in this product category.

Premix, the leading specialist in conductive plastics, launches the PREPERM® product family with customizable dielectric properties for high-frequency applications. The new product range provides high-frequency device manufacturers with an outstanding material that maximizes performance without increasing overall costs. PREPERM grades can be cost-effectively injection molded to high frequency antenna parts.

Linear Technology announces the LS8 reference family, a series of hermetic precision voltage references packaged in a 5 x 5 mm surface mount, low stress ceramic package. These precision voltage references offer outstanding long term stability and consistent predictable behavior, over time and operating conditions. For instrumentation that demands the best possible performance over years or decades of operation, the LS8 package offers an alternative to large metal can or ceramic DIP packages.