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NXP® Semiconductors announced that its single-chip NFC and embedded secure element solution, the SN220, has been certified by the Car Connectivity Consortium® (CCC) under its CCC Digital Key™️ Certification Program.
Richardson RFPD, Inc. announced the availability and full design support capabilities for a curated selection of product recommendations that support 3.3 to 3.98 GHz, 5G Thin mMIMO RF front-end development.
Yole Group provides a comprehensive review of UWB technologies, highlighting and comparing the solutions implemented in smartphones by leading companies, Apple, Samsung and Google (Qorvo).
Richardson RFPD, Inc. announced the availability and full design support capabilities for a new reference design from NXP Semiconductors, the A3G26D055N-100.
NXP® Semiconductors announced a new series of RF power discrete solutions for 32T32R active antenna systems, complementing NXP’s existing portfolio of discrete GaN power amplifier solutions for 64T64R radios.
NXP® Semiconductors announced that NXP’s Layerscape® and Layerscape Access family of processors have been chosen by Compal Electronics to power its new 5G integrated small cell solution.
Richardson RFPD, Inc announced the availability and full design support capabilities for several new RF power multi-chip modules and the RapidRF demonstration platform from NXP Semiconductors.