Items Tagged with 'booth'

NI announces that NI AWR Design Environment™ V12 will be highlighted at the Electronic Design Innovation Conference (EDI CON) 2016, being held in Beijing, China April 19-21. In addition to demonstrations in NI Booth #315, the software will be featured in two 40-minute workshops.

 Welcome to NI AWR Booth #103. At the booth, we will be showcasing a wide variety of software demonstrations of our recently released V11 NI AWR Design Environment™, which includes Microwave Office, Analog Office, Visual System Simulator™ (VSS), AXIEM, and Analyst™ for the design of MMICs, RF PCBs, microwave modules, RFICs, communication systems, radar systems, antennas and more. 

Richardson RFPD Inc. announces its attendance and participation at EDI CON 2014, including its sponsorships of the GaN Panel and Small Cell Workshop.

Gowanda Electronics, a US-based designer and manufacturer of precision electronic components and inductors for power, radio frequency (RF), and high frequency (HF) applications, is teaming up with its recently acquired sister company, TTE Inc., also a US-based company, to provide a broader range of electronic components to the global design engineering community. TTE Inc. designs and manufactures RF and microwave filters for critical markets including defense and test & measurement.

Richardson RFPD Inc. announces its attendance and participation at the 2014 Applied Power Electronics Conference and Exposition (APEC). APEC focuses on the practical and applied aspects of the power electronics business, and it draws attendance from all facets of the industry, from manufacturers, designers and suppliers, to individuals involved in marketing and sales.

LPKF Laser & Electronics has announced it will exhibit at the Satellite 2014 exhibition, which takes place March 11-13 at the Walter E. Washington Convention Center in Washington, D.C. LPKF provides in-house rapid PCB prototyping systems for a variety of applications and will demonstrate its best-selling system, the ProtoMat S63, in booth 8120.

X-COM Systems LLC, a subsidiary of Bird Technologies, will be exhibiting its products for broadband signal capture, recording, playback, and multi-channel signal generation at the 50th AOC International Symposium and Convention, October 27 to 30 in the Marriott Wardman Park Hotel, Washington, DC. The company will also have its Mobile Measurement Vehicle (MMV) on the exhibit floor. The MMV is a customer-tailored mobile measurement suite housed in a van that can be configured to provide all of X-COM’s capabilities including direction finding.

AWR Corp., the innovation leader in high-frequency EDA software, exhibits at COMCAS 2013 and IME 2013 in Israel and China the week of October 21, 2013.  At each show, the latest release of Microwave Office®, Visual System Simulator™(VSS), Analyst™, AXIEM®, and Analog Office® for the design of MMICs, RF PCBs, RFICs, microwave modules, communication systems, radar systems, antennas and more will be showcased.

AWR Corp., the innovation leader in high-frequency electronic design automation (EDA), announces that NXP Semiconductor's ultra-wideband (UWB) Doherty reference design is now AWR Microwave Office design environment ready. The updated release features NXP’s BLF884P and BLF884PS transistors for ultra-wideband Doherty power amplifiers operating from 470 to 806 MHzand a 70 W DVB-T UWB LDMOS reference design using NXP’s patent-pending architecture capable of operating over an ultra-wideband spectrum in the UHF broadcast spectrum.

Richardson RFPD Inc. announces its attendance and participation at the 2013 International IEEE COMCAS. The annual conference provides a multidisciplinary forum for the exchange of ideas, research results, and industry experience in the areas of microwaves, communications, antennas, solid state circuits, electromagnetic compatibility, electron devices, radar and electronic systems engineering.