Items Tagged with 'integration'

As part of the French Nano 2022 public-private program, UMS and several French partners will develop “smart RF solutions,” new integration technologies for systems in package (SiP).

Smart Equipment Technology (SET), a leading supplier in high accuracy die-to-die and die-to-wafer bonders, announced its participation in the 3D integration consortium of IRT Nanoelec, which is headed by CEA-Leti. SET joins Leti, STMicroelectronics and Mentor Graphics to develop advanced 3D die-to-wafer stacking technologies, using direct copper-to-copper bonding.

Remcom announces the integration of XFdtd® Electromagnetic Simulation Software and Optenni Lab™ matching circuit optimization software. The Optenni addition enables XFdtd users to more easily generate a matching network topology and initial component values for their device. Once the topology is chosen and physically laid out on the PCB, XFdtd’s Circuit Element Optimizer completes the matching network design process by determining the optimal component values using full wave FDTD simulation, taking electromagnetic phenomena, such as coupling, into account.

Peregrine Semiconductor Corp., founder of RF SOI (silicon on insulator) and pioneer of advanced RF solutions, announces the next chapter in intelligent integration—integrated phase and amplitude control at microwave frequencies.

 Antenova Ltd, manufacturer of antennas and RF antenna modules for M2M, is announcing the Weii, a new miniature ceramic antenna for all 2.4GHz, Bluetooth, Wi-Fi, Zigbee and ISM applications. 

CRFS has entered an agreement with Metis Aerospace to supply RFeye® Nexus receivers for integration into Metis’s HYPERION system for high accuracy airborne and ground based mobile COMINT/SIGINT applications. HYPERION is a lightweight, compact and a cost-effective solution for most air platforms from small UAVs up to multi-mission manned platforms.

 Innovative Integration, a trusted supplier of signal processing and data acquisition hardware and software solutions, today announced the FMC-500. The FMC-500 is a high-speed digitizing and signal generation FMC IO featuring two, 500 MSPS A/D channels. The module also provides a dual-channel 1230 MSPS DAC plus ultra low-jitter PLL sample clock and triggering features. 

Texas Instruments and Netas, a Turkish based value-added systems integration and technology services company in the fields of information and communications, announced their collaboration on an LTE-Advanced (LTE-A) macro base station for a new public safety network commissioned by the government of Turkey. Netas has selected TI's KeyStoneTM-based wireless infrastructure System-on-Chip (SoC), the TCI6638K2K, for the baseband processing in the solution, while implementing its own proprietary software.

Remcom announces a new version of Wireless InSite®, its electromagnetic propagation software for the analysis of wireless communication systems. This version, Release 2.7.1, offers integration with the Geospatial Data Abstraction Library (GDAL), improving import processing and significantly expanding supported file formats.

Hunter Technology Corp. announced its acquisition of the equipment and inventory assets of Spectral Response LLC (Lawrenceville, GA), an EMS supplier providing a broad range of product design and manufacturing solutions to electronics and RF OEM customers. This is Hunter’s second major acquisition in the past six months, following the purchase of assets of NBS Designs, Inc. (Milpitas, CA) last October.