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The Biden-Harris Administration announced that the U.S. Department of Commerce and GlobalWafers America, LLC and MEMC LLC, subsidiaries of GlobalWafers Co., Ltd. have signed a non-binding PMT to provide up to $400 million in proposed direct funding under the CHIPS and Science Act.
Samsung and Cadence co-develop Mixed-Signal OpenAccess-ready PDKs that enable seamless implementation and verification of mixed-signal designs for data centers, networking, 5G, mobile, industrial and automotive applications.
