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Items Tagged with 'WLP'

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Akoustis Completes Qualification of Wafer-Level-Packaging

January 3, 2023

Akoustis Technologies, Inc. announced that it has completed qualification and released its internally developed proprietary wafer-level-packaging (WLP) technology for the 5G mobile, Wi-Fi, timing control and other markets.

ACM Research Launches Its First Plating Tool to Support Wafer-Level Packaging and Plating Applications

Automated system for flat or notched wafers; multiple orders to ship during third quarter of 2021

August 26, 2021

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ACM Research, Inc. announced the launch of ACM’s Ultra ECP GIII plating tool to support wafer-level packaging for compound semiconductors, with product offerings for SiC, GaN and GaAs.