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Indium Corporation announced the global availability of CW-807RS, a new high-reliability, halide-free and halogen-free flux-cored wire that improves wetting speeds and cycle times for electronics assembly and robot soldering applications.
Indium Corporation® announces that it is now offering CW-818, a uniquely formulated no-clean, high-reliability flux-cored wire designed to minimize cycle times in manual and robotic soldering processes while delivering top tier soldering speed and spread.
COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide. Arkansas Power Electronics Intl. (APEI) introduces the first multiphysics simulation app built with COMSOL's Application Builder.
Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Jiro Hashizume recently joined the company to head up its new subsidiary, Hesse Mechatronics Japan Co. Ltd.
Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that Hesse GmbH will demonstrate a full range of wedge wire bonding capabilities at Productronica, taking place November 12-15 in Munich, Germany, in Hall B2, Booth 255.
Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, recently opened its newest training and applications lab in Tempe, AZ.
Hesse Mechatronics Inc., the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders and ribbon bonders for the backend semiconductor industry, announces that it will introduce and demonstrate the new Bondjet BJ931L in booth 6081 in the North Hall at SEMICON West, taking place July 9-11 in San Francisco.
Carlisle Interconnect Technologies’ (CarlisleIT) president, John Berlin was awarded the 2013 WCMA Distinguished Career Award by the Wire & Cable Manufacturers Alliance Inc. (WCMA) on April 13th, 2013. This award is given to notable individuals in the Wire & Cable industry based on their significant commercial or technical contributions over a minimum 25-year industry career.
Hesse Mechatronics, Inc. (formerly Hesse & Knipps), leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire and ribbon bonders for the backend semiconductor industry, announces that it will offer application development, prototyping and pre-production services on a newly installed BONDJET BJ939 Fully Automatic Heavy Wire Bonder.
Hesse Mechatronics Inc. (formerly Hesse & Knipps), the Americas subsidiary of Hesse GmbH, leading manufacturer of high-speed fine pitch wedge bonders and fully automatic heavy wire bonders for the backend semiconductor industry, has appointed Michael McKeown as senior business development manager.
COMSOL Multiphysics users are already building applications and exploring the benefits of sharing their models with colleagues and customers worldwide. Arkansas Power Electronics Intl. (APEI) introduces the first multiphysics simulation app built with COMSOL's Application Builder.