Items Tagged with 'ball'

IKE Micro announces the completion of its in-house air cavity array packaging capability. The line includes automatic 01005/0201 SMT placement, die attach from wafer and waffle pack, wedge wire/ribbon and ball bonding, coil attachment, lid marking, lid attachment and dicing of array assemblies. 

A Ball Aerospace & Technologies Corp. instrument essential for a new era in precipitation measurements has arrived in Japan where it will launch aboard NASA’s Global Precipitation Measurement (GPM) mission.

NASA’s Green Propellant Infusion Mission (GPIM) has been selected to test an advanced form of thermal insulation, called integrated multi-layer insulation (IMLI) that could become standard on future satellites and cryogenic subsystems. Validating this new insulation in space will help NASA build the technology required for long human spaceflight missions. Under a subcontract from Ball Aerospace & Technologies Corp., Quest Thermal Group LLC will manufacture the new insulation that will fly aboard the 2015 GPIM mission.

SemiGen, Inc. has announced today they have placed an order for a Palomar 8000 Auto Ball Bonder to round out their state-of-the-art RF/Microwave assembly line.