White Papers

Rohde and Schwarz

An Overview of Space Electronic Warfare

This paper provides an in-depth exploration of space EW - from the space domain ecosystem to important EW technologies. Learn about the five Ds of offensive space EW, jamming mitigation techniques and much more. Additionally, discover a range of cutting-edge tools that can be employed for effective EW activities in space.

Anritsu

Emerging Radar and Electronic Warfare (EW) Challenges: Developing Test Strategies

Our comprehensive approach integrates advanced tools and software with high-performance instruments to give you the flexibility, speed, and cost-efficiency you need to stay ahead of the competition. With our cutting-edge test solutions, you can rest assured that your military systems are always up to date and ready for battle.

Remcom_

Transient EM/Circuit Co-Simulation in XFdtd®: A Closer Look at TVS Diodes for ESD Protection

TVS diodes help protect electronic circuits from surge voltages associated with an ESD event.  This paper demonstrates XFdtd’s transient EM/circuit co-simulation capability, an approach that embeds a transient nonlinear circuit solver in the full-wave simulation so that all electromagnetic phenomena are accounted for in a single time-domain simulation.
Custom Interconnects

Fuzz Button Technology Providing Internconnect Solutions for Quantum Computing Systems

Quantum computing technology has the potential to trigger a new industrial revolution, thanks to its exponentially powerful computation capabilities.  The development of large-scale quantum computers requires critical components for high-frequency signal transmission, namely interconnects and interposers.
NSIMI

Overcoming Challenges in RCS Measurements using a High Order Basis Function Method of Moments Technique

Characterizing Radar Cross Section (RCS) is no easy task. Most ranges use low back-scattering pylons that require a low RCS target to hide the top edge of the pylon to measure the effect of the support. This article explores the idea of using a numerical technique as an effective alternative. 
Fortify

Overcoming Size Limitations - the RF Performance Impace of Segmentation and Assembly on 3D Printed Luneburg Lenses

Segmentation is a powerful tool in extending the capabilities of otherwise workpiece size or workspace limited Additive Manufacturing technologies, and can enable the fabrication of complex dielectric structures. This is especially critical for highly intricate dielectric structures, such as metastructures, and Luneburg/GRIN RF lenses greater than 4.5” in diameter. 
pSemi

5G NR Challenges & Trends in RFFE Design

The proposed capability enhancements from 4G long-term evolution (LTE) to 5G new radio (5G NR) were a massive leap designed to boost mobile telecommunications applications and enable many more. Aside from significantly boosting all major performance metrics, the 4G to 5G transition also heralds a more flexible and capable radio architecture with additional millimeter-wave frequency spectrum on top of legacy 4G LTE-Advanced (LTE-A) and new sub-6 GHz frequency bands. 
RohdeSchwarz

OTA Characterization of Phased Array Antennas and Antenna in Package (AiP)

With its small footprint, the R&S®ATS1000 antenna test system is the ideal direct far-field OTA system to test phased array antennas. The system tests and optimizes the radiation characteristics of any modules using the AiP technology from 18 GHz to 87 GHz. Register and learn more in our paper.

Altair_WP_OptAntennaPerformance.pdf

This document looks at how Feko—in conjunction with Altair’s solutions for design simulation, exploration and optimization, structural assessment, and thermal analysis—can help antenna designers develop and verify their antenna solutions quickly, accurately, and efficiently. It will focus on how to realize automated, iterative design optimization through modelling and visualization.
Samtec

Millimeter Wave Design: Optimizing Performance in RF Compression Mount Connectors

In millimeter wave designs, compression mount connectors can be used to avoid problems commonly associated with solder variations. However, when using compression mount connectors, the potential impact of pin compression and/or misalignment on electrical performance at high frequencies should be considered. Using modeled and measured data, this white paper investigates how misalignment and pin compression could impact a real-world design. It also explains how to detect and avoid issues in order to optimize performance and complete a successful design.