White Papers

Optimizing Your Millimeter-Wave Test Capability

Testing at millimeter-wave frequencies brings new and different measurement challenges, so minimizing measurement uncertainty is critical in the development of these new technologies. This white paper discusses the challenges associated with millimeter-wave testing and how to optimize your Vector Network Analyzer (VNA) measurement capability to provide the confidence required to make performance/cost tradeoffs.

High Voltage Inverting Charge Pump Produces Low Noise

Dual-polarity supplies are commonly needed to operate electronics such as op amps, drivers, or sensors, but there is rarely a dual-polarity supply available at the point of load. The LTC®3260 is an inverting charge pump (inductorless) DC/DC converter with dual low noise LDO regulators that can produce positive and negative supplies from a single wide input (4.5V to 32V) power source. It can switch between high efficiency Burst Mode® operation and low noise constant frequency mode, making it attractive for both portable and noise-sensitive applications.

CVD Diamond High Power Resistors and Terminations

Commonly used substrates for high power resistors and terminations are Beryllia, Aluminum Nitride, and to alesser extent, Boron Nitride and Silicon Carbide. While these materials are known for their superior thermal properties, none of them come even close to matching the thermal conductivity of CVD Diamond.

Biasing Constant Current MMICs

The Mini-Circuits family of microwave monolithic integrated circuit (MMIC) Darlington amplifiers offers the RF designer multi-stage performance in packages that look like a discrete transistor.

Secondary Radar Transponder Testing Using the 8990B Peak Power Analyzer

Learn more about the background of radar systems and the role of transponders in these systems, and why periodic maintenance and calibration of transponder test sets are important for ensuring aviation safety. This application note provides examples of how to effectively test transponders to validate their performance and function, covering topics such as interrogation and reply transmit power and pulse profiling, double pulse spacing, and reply delay timing measurement.

Radar and Radio Range Simulation

Fiber Optic Delay Line systems (FODL) are used in test and development laboratories to eliminate outdoor range testing of radio and radar systems. Outdoor range testing is costly, complex, and time-consuming.

Superposition vs. True Balanced: What's Required for Your Signal Integrity Application

The True Balanced/Differential technique uses two sources to create actual differential and common-mode stimuli, hence the shortened name true-balance. This white paper offers guidance to signal integrity designers on the differences between these approaches and which one may best fit their need.

Amplifier Poster

A ready reference poster of multiple RF/microwave amplifier graphs and tables from AR RF/Microwave Instrumentation .

What Is a Vector Signal Transceiver (VST)?

Software-defined RF test system architectures have become increasingly popular over the past several decades. Almost every commercial off-the-shelf (COTS) automated RF test system today uses application software to communicate through a bus interface to the instrument. As RF applications become more complex, engineers are continuously challenged with the dilemma of increasing functionality without increasing test times, and ultimately test cost. While improvements in test measurement algorithms, bus speeds, and CPU speeds have reduced test times, further improvements are necessary to address the continued increase in the complexity of RF test applications.

Signal Integrity:Frequency Range Matters!

Higher data rates introduce new challenges for test solutions. There are several 20+ Gbit/s high speed standards (Table 1) that are driving the upper end of the test spectrum to 70 GHz and even 110 GHz. Accurate measurements are needed to better understand higher order harmonics, as will new challenges related to conductor skin effects and dielectric losses on PC boards, along with the design trade-offs related to choices of vias, stackups, and connector pins.