White Papers

Learn about three key trends paving the way to heightened communications capabilities and enhanced security for emergency responders and military personnel.

Tighter tolerances, manufacturing complexity, and more demanding product specifications make product quality harder to achieve and harder to test. Read the ABC’s of test accuracy.

Since each generation of IoT devices needs to be smaller, more robust, easier to configure and use less power than before, designers and engineers need to know the challenges involved. Download the whitepaper to learn how to navigate these.

Taking a single temperature measurement on a device is simple. But what if you need more robust temperature data logging like making multiple measurements at a time? Read this white paper for help determining the data acquisition system (DAQ) to best fit your temperature data logging needs.

Since the advent of Network Synthesis Theory at the turn of the last century, filter designers have been developing ever more sophisticated solutions to translate polynomial transfer functions into working, physical components.

With PC-based spectrum analyzers becoming mainstream, maintaining the status quo begs the question: Why let big, expensive spectrum analyzers of the past limit your test capabilities and capacity?

With the rollout of 5G infrastructure, the 5G interference signals will be powerful enough to saturate the sensitive C-band satellite receiving systems, causing a potential for total loss of service. To eliminate or control any electromagnetic interference one must focus on three major fronts -the transmitter, the medium of propagation and the receiver.

This paper outlines how crucial it is to measure and understand the actual noise floor of a phase noise analyzer with a known level of confidence in your data versus relying on calculated noise floor approximations.

This application note aims to explain test procedures and give recommendations towards characterization of the relevant parameters for active phased array antennas and their passive subsystem, as often used in applications for Mobile Communication and RADAR.

Mechanical integration of microwave components often becomes the last step while addressing manufacturing considerations for system-level designs. In many cases, the electrical design is analyzed, boards built, designs reverified, then mechanical engineers fit everything into the final package. This paper shows how component manufacturers can help solve system-level packaging problems using Airstrip technology.