White Papers

3D-ICs integrate many dies that are densely packed, which leads to heat generation that causes performance issues. This white paper helps designers understand the cross-fabric thermal challenges introduced by 3D-ICs and explains how the Cadence® Celsius™ Thermal Solver helps designers analyze and develop strategies to mitigate this impact.

The spectral environment is quickly changing today. It’s becoming more crowded, which is resulting in an increase in spectral noise. This is presenting a variety of new challenges for RF designers, both in terms of the architecture and power needed to transmit and receive signals and the types of jobs filters need to perform in receivers (Rx) and transmitters (Tx).

Reporting progress at Teledyne e2v to replace copper with fiber as the physical transport layer, connecting data converters to digital signal processors. The goal is to substantially simplify high-throughput data converter interconnect to enable remotely positioned converters. Exploiting lightweight optical fiber is seen as the key here, opening microwave RF systems to future innovation.

As wireless devices and systems spread across every industry, spectrum analyzers serve as an essential RF test tool for characterizing signals and making frequency measurements. Download Rohde & Schwarz's definitive guide to understanding the technology behind spectrum analyzer measurements.

Over the past several decades, wireless system channel counts and bandwidths have steadily increased. The driving factors for these modern telecommunication, radar, and instrumentation systems are their data rate and overall system performance requirements. However, these requirements have also increased power envelopes and system complexities, making power density and component level features more important.

This book from Qorvo® provides a general understanding of the IoT and the protocols and architectures that provide the backbone of IoT communications. It also gives us a look into today and future applications of the IoT as well as how they are shaping the world around us.

This white paper provides in-depth guidance in navigating 5G VoNR from the network deployment and the connectivity options aimed at not only supporting VoNR, but also ensuring the data services that VoNR should enable. A brief summary is also provided on the signaling parameters for both the network and UE side.

Designing advanced wireless systems is daunting. Modelithics high-fidelity RF system models, now in PathWave System Design, minimize complexity by providing real-world system simulation. Keysight’s latest White Paper, Highly Accurate RF System Modeling for Wi-Fi and Cellular Interference Analysis, demonstrates how to apply these models in an interference analysis of Wi-Fi and LTE coexistence.

While traditional RF and microwave applications are predominantly focused on wireless communication or navigation, recent advances in device technology have opened up an exciting range of non-communication, non-navigation applications of RF and microwave power. Dielectric heating is an important part of any RF and microwave heating process.

TVS diodes help protect electronic circuits from surge voltages associated with an ESD event. XFdtd’s transient EM/circuit co-simulation capability combines the strength of 3D full-wave electromagnetic simulation with the flexibility of circuit solvers. This paper examines the approach, which embeds a transient nonlinear circuit solver in the full-wave simulation so that all electromagnetic phenomena are accounted for in a single time-domain simulation.