EDI CON Online

Title: Accelerating RF PCB System Development

Date: August 11, 2021

Time: 8:30am PT / 11:30am ET

Sponsored by: Cadence

Presented by: David Vye, Sr. Product Marketing Manager, Cadence

Abstract:
Most RF/mixed-signal PCB design and system integration requires a workflow that not only supports interoperability between the design tool responsible for RF/microwave IP creation and the manufacturing/signoff platform, but also properly manages SMD library parts, padstacks, and technology files in order to avoid time-consuming, error prone, manual translation flows. This presentation will examine the requirements for a more robust RF-to-PCB layout workflow, focusing on design-for-manufacturing requirements typically managed within the layout tool itself. RF engineers will learn more about PCB layout and manufacturing CAD concerns that improve and accelerate handoff from RF design to PCB layout.

Presenter Bio:
David Vye is the technical marketing director for AWR software at Cadence responsible for product messaging and positioning into the RF/microwave market. A former editor and business development manager for Microwave Journal, David has held a number of technical and marketing positions throughout the RF/microwave industry, including business development manager at ANSYS, product marketing manager at Ansoft Corporation, senior design engineer at Raytheon Research Division and Advanced Device Center, and MMIC design engineer at M/A-COM's Advanced Semiconductor Operations. He holds a BSEE from the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.

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