Microwave Journal is pleased to announce the 1st annual USA Electronic Design Innovation Conference.

EDI CON is a new and unique event experience. It brings the high frequency electronic and high speed digital design communities together to address the engineering and manufacturing issues that face today's design engineers. Practical content is presented in technical forums, workshops and panel sessions and targets engineers working in the communications, aerospace and defense sectors. Unlike most academic-driven conferences, the EDI CON exhibition and conference are synergistic, with industry experts presenting technical content and displaying the latest solutions in the exhibition.

For more information, contact Alyssa Connell at 781-619-1930 or e-mail: aconnell@mwjournal.com.

EDI CON USA 2016 brochure

EDI CON USA 2016 floorplan

EDI CON USA 2016 application to exhibit