Lapping and Polishing are processes which are performed to achieve a desired surface finish, thickness, parallelism, flatness, and camber of any substrate. Services also includes laser cutting, laser welding, laser marking.
DownloadThis guideline is specifically written for laser machining metals ranging in thickness from .005’’ to .250’’.
DownloadBrochure describes Accumet's laser processing, lapping, polishing and supply chain service capabilities.
DownloadTech briefs offers DFM tips for optimizing hermetic seals.
DownloadTech brief describes pre-metallization benefits of lapping and polishing ceramic substrates.
DownloadTech brief describes fabrication choices for power electronic performance and yield.
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