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Marketwatch, September 2010: A Closer Look at GaN vs. Tubes

August 31, 2010
David Vye
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Departments

September Departments

Defense News:

MarketWatch

Strong Growth Ahead for Military Airborne Radio Semiconductor Market

TASC Implements 3-D RFID Asset Management System for US Navy

Lockheed Martin and Raytheon Partner for GMD Development and Sustainment Contract

Harris Awarded Antenna Contract

International Report:

Study Addresses European Military Aerospace Development

UK Government to Revolutionise Digital Infrastructure

European Project on Integrated Electronic System-in-Package Solutions

NGMN Alliance and TM Forum Sign Next Generation Network Agreement

Commercial Market:

Wireless Sensor Networks and RFID in Asia

Skyworks Maintains PA Share Lead

Low Bands to Dominate in LTE Mobile Devices Through 2014

Handset Semiconductor Revenue to Increase

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MarketWatch
September 2010

ABI Research has just released a report that looks at the microwave tube market and concludes that it is currently safe from losing significant market share to new high power solid-state devices such as GaN. This was the same conclusion offered by David Zavadil of Teledyne MEC back in 2008. Here's Zavadil's explanation why.

Tubes Turf>>

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2010 Editorial Calendar & Planning Guide>>

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A Conversation With Mario Rivas

June 16, 2010
David Vye
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President and CEO of ANADIGICS talks about his company’s 25 year anniversary, their GaAs technology and their relationship with Win Semiconductor, the handset and cable markets and the advantage of GaAs-based 3G power amplifiers over competing technologies.
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TestBench Archives

Preview and links to past TestBench articles, a monthly feature of WWW.MicrowaveJournal.Com
June 16, 2010
David Vye
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December 2010 Aeroflex Introduces New SGA By Aeroflex Aeroflex has just introduced a new range of general purpose portable benchtop RF instruments at an attractive price. The first products include two SGAs covering the 100 KHz to 3 and 6 GHz range. These signal generators are compact and lightweight...
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EDAFocus Archives

Preview and links to past EDAFocus articles, a monthly feature on RF/microwave design and manufacturing support software.
June 16, 2010
David Vye
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October 2010 HSPICE Enhances Speed and Capacity By David Vye, MWJ Last month, Synopsys announced HSPICE® Precision Parallel (HPP) multi-threading technology would be a significant enhancement to the next release of the analog/mixed-signal circuit simulator HPICE 2010. The new capability, which utilizes a scalable multi-core engine, delivers up to...
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Marketwatch, June 2010: A Conversation with Mario Rivas

ANADIGICS CEO looks ahead as company celebrates its 25th year of operations
June 15, 2010
David Vye
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Departments

June Departments

Defense News:

AEGIS Upgrades Drive Advanced Electronic Market Demand

Lockheed Martin GPS III Team in Critical Design Review Phase

Raytheon-Boeing Team Fires First Joint Air-to-Ground Missile

Harris Corp. Receives Order for High-frequency Radio Systems

International Report:

GSA Reports Global March of Mobile Broadband

Mobile Broadband Infrastructure: BuNGee Project Bounces into Action

Centre for Energy-efficient Telecommunications Established in Australia

AESA Radar Centre of Excellence for Brazil

Commercial Market:

3G Handset Sales Eclipse 2G Market

UMS USA Inc. Celebrates One Year of Exercise

Cellular and Mobile Broadband PC Modem Market Up 55 Percent

Raytheon Installs Frost Protection System in Canadian Vineyard

Latest Trends in Mobile Handset Design


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MarketWatch
June 2010

Mario Rivas, President and CEO of ANADIGICS talks about the handset and cable markets and the advantage of GaAs-based 3G power amplifiers over competing technologies.

MWJ talks to ANADIGICS >>

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Got a story? The MWJ editorial calendar can help you plan for optimum exposure.

2010 Editorial Calendar & Planning Guide>>

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Peregrine's UltraCMOS Poised for Growth

Proprietary SoS (UltraCMOS) technology and new strategic partnership with IBM, puts Peregrine in a strong position.
June 15, 2010
David Vye
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UltraCMOSTM Poised for High Growth

Peregrine's recently announced partnership with IBM leverages the company's high performance devices with a new level of manufacturing capacity as next-generation, silicon-on-sapphire technology will be based on IBM's 180-nm process on 200-mm wafers.

A look at Peregrine >>


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