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David Sherrer, Director of Research and Product Development at Rohm and Haas Electronics Materials, spoke with Microwave Journal about Rohm and Haas’ new PolyStrata™ micro-fabrication technology. This new process produces perfectly shielded, low-loss, broadband transmission line networks, which enable low-cost, miniaturized and highly integrated component and systems for complex microwave and millimeter-wave applications.
Brian DuPell, President of DLI, spoke with Microwave Journal editor David Vye about today’s spectrum management challenges, the RADAR market and the role of High-Q ceramic-based RF/mW components play in achieving the system performance required by today’s military and commercial applications.
Microwave Journal editor, David Vye, spoke with Brian P. Balut, Vice President, Networks Business Unit, TriQuint Semiconductor Inc., about the company's product portfolio, the challenges of WiMAX, various semiconductor technologies, and what the mobile WiMAX market is looking for.
Microwave Journal editor, David Vye, spoke with Brian P. Balut, Vice President, Networks Business Unit, TriQuint Semiconductor , about their product portfolio, the challenges of WiMAX, various semiconductor technologies, and what the mobile WiMAX market is looking for. Mr. Balut joined Sawtek in October 1994 as Sales Manager. He...
Sherry Hess recently joined AWR, bringing with her nearly 20 years of senior management, sales, marketing and international business development experience in the semiconductor and EDA industries. In this exclusive online interview, Hess discusses AWR's newest EM product, AXIEM™.
Microwave Journal had the pleasure of speaking with Todd Cutler, who is currently a Senior Manager with Agilent Technologies’ EEsof EDA Division, responsible for marketing, services and the ESL Business. He shares his perspective on the recent integration of Agilent’s Momentum 3-D planar EM solver into the Genesys platform.
To produce more circuit functionality, leading-edge designs rely on high-speed devices, using the latest IC process nodes and advanced package technologies. As the complexity of these electronic products intensifies, constraining EM emissions within dense printed circuit boards (PCB), IC packages and even the IC itself requires careful engineering. With...
Technical Feature Performing Transient Analysis on PLL Frequency Synthesizers A PLL can be considered a subsystem within a larger communications system, so it is appropriate to analyze this type of network with the help of a system-level simulator. The use of flexible behavioral models within the simulator allows only...
