Articles by Richard Mumford

Attending European Microwave Week 2005

The Eiffel Tower is an instantly recognisable landmark and symbol of the vibrant city of Paris, and although European Microwave Week is a good few hundred years younger, similarly it has begun to establish itself as a landmark event for the industry, where the focus is on Europe but...
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ESOs and the EC Set Standardisation Objectives

When the chief officers of the three European Standards Organisations (ESO) met with Günter Verheugen, vice president of the European Commission in charge of Enterprise and Industry, to discuss the contribution that CEN, CENELEC and ETSI can make to promote growth, competitiveness and employment in the European Union, the...
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Alliance Extends Semiconductor R&D Activities

The Crolles2 Alliance partners, Freescale Semiconductor, Philips and STMicroelectronics, have extended the scope of their joint semiconductor research and development activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100 nm CMOS process technologies. This agreement reflects the special needs...
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Icomera Gets on Track in Sweden

Scandinavian train operator, SJ, has awarded Icomera the €11 million contract to equip its fleet with the company’s Wireless Onboard Internet Service. Under the terms of the contract Icomera will deliver its Intercity Edition for the current X2000 train type and Commuter Edition for the new X40 fleet. Significantly...
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Filtronic and RFMD Broker Strategic Supplier Relationship

Filtronic plc, a global designer and manufacturer of customised microwave electronic subsystems and components for the wireless telecommunications and defence industries, and RF Micro Devices Inc. (RFMD), have signed a supply agreement for the manufacture of high volume pHEMT GaAs products on the Filtronic 6 inch processing facility based...
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Alliance Extends Semiconductor R&D Activities

The Crolles2 Alliance partners, Freescale Semiconductor, Philips and STMicroelectronics, have extended the scope of their joint semiconductor research and development activities to include R&D related to wafer testing and packaging, in addition to the original development of sub 100 nm CMOS process technologies. This agreement reflects the special needs...
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