Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne

Articles by Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne

Multi-layer Thin-film MCM-D for the Integration of High Performance Wireless Front-end Systems

A new approach for the integration of high performance wireless front-end systems using multi-chip modules

February 1, 2001

Geert Carchon, B. Nauwelaers, K.U. Leuven, P. Pieters, K. Vaesen, W. DeRaedt, E. Beyne

Technical Feature Multi-layer Thin-film MCM-D for the Integration of High Performance Wireless Front-end Systems Thin-film multi-layer multi-chip module with deposited substrate (MCM-D) technology using the system in a package concept is presented as a viable approach for the integration of high performance wireless front-end systems. Due to the high...