Three strongly interrelated aspects of thick-film termination design: materials and processes, thermal management and RF impedance matching
TECHNICAL FEATURES Design Considerations for Thick-film High Power Chip Terminations Robert Grossbach American Technical Ceramics Huntington Station, NY A s the wireless revolution extends component requirements upward in frequency, higher in operating power and smaller in size, the performance demands on surface-mount devices grow ever more stringent. Chip terminations...
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