DuPont Electronics & Imaging and SCHMID Group announce that they have entered into a nonexclusive joint development agreement to explore new PCB plating applications to bring advanced innovations to our global customers. The partnership will benefit high-end printed circuit board manufacturers by delivering next-generation interconnect products and metallization processes that can create faster, smarter and more reliable devices for the 5G era. The new solutions which will include equipment and chemistry are expected to be launched in late 2020.
