RJR Technologies, a leading developer of high performance Air Cavity Plastic (ACP) packaging, announced that it has shipped over 10 million ACP packages. As a high volume manufacturer of semiconductor packaging for RF and microwave markets, RJR’s milestone reflects the increasing use of plastic packages in high performance, high frequency RF applications.
RJR Polymers, a leading developer of high performance liquid crystal polymer (LCP) Air Cavity semiconductor packaging (ACP), announced that it has changed its name to RJR Technologies Inc. The new name reflects the company’s growing role as a leading developer and high volume manufacturer of high performance LCP Air Cavity plastic packaging for RF and microwave applications. The company will begin operating under its new name and form a new website, www.rjrtechnologies.com, immediately.