Articles by Indium Corp.

Indium Corp. introduces a new Pb-free solder paste designed to combine best-in-class stencil printing performance, using Indium’s unique halogen-free oxidation barrier technology with optimized no-clean residues for enhanced probe testing. Indium8.9HF1-P saves time and money on testing by eliminating false failures and giving the highest first pass yields.

Indium Corp.'s Dr. Weiping Liu, research metallurgist, will present at the 15th Electronics Packaging Technology Conference (EPTC) December 11-13 in Singapore. 

Indium Corp. was presented with the Global Technology Award for its SACM™ Solder Alloy at Productronica in Münich, Germany on November 12. 

Indium Corp.'s Dr. Ning-Cheng Lee, vice president of technology, and Dr. Ron Lasky, senior technologist, will present at the SMTA/iNEMI Medical Electronics Symposium November 13-14 in Milpitas, CA.

Indium Corp. will feature its new technology platform using the SACM™ Solder Alloy at Productronica November 12-15 in Münich, Germany. 

Indium Corp. announces the promotion of two technical managers in the company’s Asia-Pacific operations.