ARTICLES

Rogers Corp. to showcase advanced connectivity material solutions at IPC APEX EXPO 2016

Rogers Corp. will be exhibiting at the upcoming IPC APEX Expo scheduled for March 15-17 at the Las Vegas Convention Center, Las Vegas, Nev. Representatives from Rogers Corp. will be exhibiting at Booth #607, providing information and insight on the use of their circuit materials, including ULTRALAM® 3850HT, CLTE-XT™, TC350™ RO3003™ and XT/duroid® laminates. Rogers will also be previewing its new material system developed for extremely low loss digital applications.


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Rogers Corp. to exhibit and educate at DesignCon 2016

Rogers Corp. will be exhibiting and educating at the upcoming DesignCon show. Now in its 21st year, DesignCon is a premiere event for design chip-circuit-and system-level engineers working on high-frequency analog and high-speed digital circuits. DesignCon 2016 is scheduled for January 19-21, 2016 (January 20-21 for the exhibition) at the Santa Clara Convention Center in Santa Clara, Calif.


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Rogers Corp. to offer practical material solutions at PCB West 2015

Rogers Corp. will be at PCB West, one of the electronic industry’s major technical events, on September 16, 2015 at the Santa Clara Convention Center (Santa Clara, CA). Rogers will provide examples of its high-performance printed-circuit-board (PCB) materials and participate in the technical symposium with a talk on how to perform wideband testing of PCBs with plated finishes. 


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