Articles by NXP Semiconductors, Chandler, Ariz.

NXP Semiconductors has entered into a definitive agreement with Quintic to acquire assets and IP related to its Wearable and Bluetooth Low Energy (BTLE) IC business.

NXP Semiconductors announced that the TEF510x, the second product from the RoadLINK™ range, is now available to automotive OEMs and Tier 1 suppliers for design-in.

NXP Semiconductors has appointed Li Zheng as Senior Vice President Sales & Marketing, Greater China and Country Manager for China, who will be based in Shanghai.

NXP Semiconductors and Datang Telecom Technology Co. Ltd. have established a joint venture that is claimed to be the first true automotive semiconductor company in China.

NXP Semiconductors has introduced the first transistors in a 1.1 mm by 1 mm by 0.37 mm low-profile discrete flat no-leads (DFN) package that boost current capabilities up to 3.2 A.

NXP Semiconductors has launched its new Gen8+ LDMOS RF power transistors – an expansion of its eighth-generation LDMOS product line for wireless base stations with a strong focus on TD-LTE.

NXP Semiconductors N.V. introduced a groundbreaking family of programmable AISG transceivers for wireless base stations and antenna line devices (ALDs) such as tower-mounted amplifiers (TMAs) and remote electric tilt (RET) antennas.

NXP Semiconductors and Audi have signed a strategic partnership for innovation that focuses on innovation speed and time to market in eight selected automotive electronics application segments.

Identive Group Inc. and NXP Semiconductors N.V. are providing innovative near field communication (NFC) payment tags to Yeldi Softcom Pvt Ltd to support the launch of its ‘ara eTap’ cashless payment application in India.