IoT/M2M/V2V Channel - Latest News & Content Related to IoT

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Texas Instruments (TI) announced availability for mass production of the industry's lowest-power, dual-band wireless microcontroller (MCU) supporting sub-1 GHz and Bluetooth® low energy connectivity on a single chip.

Huawei has launched its first Enterprise Solution Partner Program, which will offer powerful support to companies that jointly develop solutions with Huawei to serve global customers.

The Weightless SIG announced availability of Weightless-P hardware and the pre-launch of a Weightless-P Software Development Kit. In conjunction with Weightless Vendor partner, Antenova, Weightless-P hardware is to be shown at CTIA SuperMobility in Las Vegas, September 7-9. A limited number of free Weightless-P SDKs will be made available to developers in an offer specific to the show.

Mobile Experts released the most comprehensive analysis ever published on the Internet of Things market space. The new report, titled IoT: The Big Picture 2016 takes a very broad look at 36 different technologies and mapping 26 applications of the Internet of Things.

Analog Devices Inc. announced the acquisition of the Cyber Security Solutions (CSS) business of Sypris Electronics LLC. This acquisition represents a significant leap forward in ADI’s ability to deliver secure high-performance analog solutions demanded by current and future market needs.

AMBER wireless GmbH, manufacturer of wireless connectivity solutions, is now part of Würth Elektronik eiSos GmbH & Co. KG.

Antenova Ltd., manufacturer of antennas and RF antenna modules for M2M and the Internet of Things, announces two more antennas for the 802.11a/b/g/n/ac wireless standard. These antennas are designed for the profusion of high bandwidth applications emerging in the consumer entertainment sector — specifically set-top boxes, IPTV and content streaming devices— all of which are seeing strong growth, in parallel with the roll-out of fibre to the home and the increase of IPTV services.

Optimal+™, the leader in big data solutions for manufacturing operations in the semiconductor and electronics industries, announced the availability of Release 6.5. This latest release includes an extension of the company’s Global Ops solution to serve the needs of electronics manufacturing operations.

Researchers from North Carolina State University and the U.S. Army Research Office have developed a way to integrate novel functional materials onto a computer chip, allowing the creation of new smart devices and systems.